eSilicon

eSilicon offers a wide range of value-added ASIC design and manufacturing services tailored to supplement its customers’ in-house capabilities. Its proprietary eSilicon Enterprise™ design infrastructure ensures higher performing ASICs and a faster time to market. The company has an enviable 100% timing closure success rate and a >95% first-time silicon success rate.
 
GDSII handoff solution
eSilicon’s GDSII handoff solution enables easy adoption of a customer-owned tooling (COT) model without the cost and overhead required to develop an internal manufacturing operation. The customer manages the chip design and delivers a GDSII layout; eSilicon manages the fabrication, packaging and test of the chip, applying design for test (DFT), design for manufacturability (DFM) package design and simulation, processor subsystem design and implementation and signal integrity (SI) techniques at the most advantageous in the product cycle.
 
More Info: Enabling Silicon Success PDF 

Web: http://www.esilicon.com